LED lights SJ-30G50G60G (gray)

LED light source modules
Multi-grain substrate packages without borders
The power of a single LED chip, more than 30W; 100W total power of light source modules within
Copper mesh inside the circuit board and electrical plants, thin, low thermal resistance (1 ~ 3 ℃)
Between the chip as a separate unit, independently of each other; each packaging unit failure, without affecting the function of other packaging unit; each crystal material failure does not affect the function of the remaining grain
So light for easy handling of secondary optics
Power Module
WPT (intelligent power regulator)
CPC (constant power control mode)
LFC (flux compensation)
OVP (Over Voltage Protection), OCP (Over Current Protection), SCP (surge current protection)
Thermal Module
Using superconducting diode cooling technology, heat the tube in the groove, nationality, taking the heat pipe by a light alloy aluminum plate, to the point heat source heat instantly converted into line, and then the heat conduction through the superconducting technology to the whole lamp housing, the wire again Surface heat into heat several times through the cooling section area increases, the rapid dispersion of heat to improve the cooling efficiency
Trench with flow dispersion, air flow can be distributed to improve the cooling efficiency
High density heat sink, can increase the cooling area, the cooling module of small and thin
AHCP (high thermal conductivity alloy tubes)
Alloy efficient heat pipe thermal resistance is 1 ~ 3 ℃, thermal conductivity rate of 100 times the copper can quickly export the heat generated by the chip, the point heat source into a line heat source, increasing cross-sectional area of heat transfer