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Epoxy resin ST-500-4H
ST-500-4H is designed for IC package with a single liquid type epoxy resin, a thixotropy, the use of thinner should be added in more than 110 ℃ can be completely cured, cured with excellent adhesion, high temperature, Moisture resistance and thermal shock resistance, bonding to the IC and the protection of fine aluminum, applicable to all types of electronic watches, calculators, games, music, cards and other electronic products, IC protection sealers.
First, the product appearance:
|
Product Name |
Appearance |
|
ST-500-4H |
黑色粘稠体 |
Second, the product viscosity and specific gravity:
|
Viscosity 25 ℃ |
130000~180000 |
|
The proportion of 25 ℃ |
1.45±0.05 |
Third, the storage conditions:
|
Storage conditions |
Save the date |
|
Below 10 ℃ |
3 months |
|
Below 5 ℃ |
6months |
Fourth, curing conditions:
|
Curing conditions |
Curing time |
|
110~120℃ |
60to90minutes |
Five operations:
1. Use with protective gloves when, in ventilated state.
2. Avoid skin contact with glue, such as accidentally gets on your skin, wash immediately with soap and clean.
3. Please note that when using the glue to thaw, remove from the refrigerator ahead of time generally required 6 to 8 hours.
