Dot Matrix LED packaging adhesive epoxy resin adhesive

The main products are as follows:

A: epoxy resin AB Series

Mainly used in electronic components, solar panels, electric stove hot plates, jewelry, accessories, gifts, handicrafts, nameplate, trademarks, signs, buttons, Zheng Zhang, lighting and other products of the coating / potting / bonding / fixed on metal, ceramic, wood, glass, fiber, stone and other materials have good adhesive strength, curing time is adjustable such products, from 1 hour to 24 hours within a variety of specifications available.

II:. Epoxy adhesive series

Applied to pin inductance, magnetic core, inductor coil, PFC transformers, electrical motors fixed or sealing adhesive, this product has one-component, two component, Excellent adhesion after curing, high temperature resistance and excellent electrical characteristics , color and liquidity can be based on customer requirements for deployment.


III: Electronic potting Series

Sub-room temperature curing and heat curing the two types, used in transformers, ignition coil, rectifier, capacitors, filters, transformers, drive, ignition, ignition coil, power controller, aquarium water pumps, power-saving module, light rails, Article Lights, negative ion generator, electronic door locks, xenon lamp (HID), electronic sensor module, the main play encapsulating security, insulation protection, waterproof effect. The smooth surface of the cured product, good gloss, no bubbles, excellent electrical properties, high dielectric strength.

IV: Optical LED Special epoxy resin series

Used in light-emitting diode (LED), digital, dot matrix, LED displays, LED modules, LED flexible light strip, LED display, LED waterproof lights, buried lights, LED lighting and other products, the viscosity of the mixed products low, good fluidity, easy foaming, can be used for a long time, curing rate of income of small places, good weather resistance, excellent light transmission rate, a very good gloss, high hardness.

Five: COB bonding Series

Electronic components, computers, toys IC bonding, fixed, secure with a cold glue, hot glue, hot glue seal so cold, high bonding strength, suitable for thixotropy, good insulation, low shrinkage after curing, thermal expansion coefficient small, according to customers with different curing conditions, different light brightness.

VI: Abrasives Glue Series

One thousand rounds, one hundred round, wheel, etc. Petiole adhesive.

Seven: Special plastic Series

High temperature plastic, high pressure rubber, fast rubber, spray glue, plastic and other battery-specific