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102 epoxy potting compound
Features
● This product is room temperature curable epoxy potting compound ● toughness, high hardness
● Excellent mechanical and electrical properties ● Excellent adhesion, anti cracking
● moisture, insulation ● Excellent heat dissipation
Use
Mixed mode:
Access before the first component A Stir
Weighing in the correct ratio of A, B two minutes, stir the vacuum deaeration after the stand, run out in 20 minutes, pouring a good device, if necessary, can continue to vacuum, help to increase the electrical properties of the device .
Curing time: 25 ℃ * 5-6h (full cure to be 24h) or 80 ℃ * 1.5h
Note: the ratio of the resin weight ratio should be, not to volume ratio to ratio, electronic weigh weight!
Technical parameters
Product Name
102
Item
A component
B component
Appearance
Black viscous liquid
Brown liquid
Viscosity mPa · s degree
15000-35000
50-100
Specific gravity
1.75
1.10
Mixed Viscosity mPa · s
1000
Mixing ratio pbw
A: B = 4: 1
Glass transition temperature DSC ℃
90
Hardness (shore D)
80
Water absorption rate%
<0.1
Coefficient of linear expansion ppm / K
44
Thermal Conductivity W / mK
0.4
Temperature range
-40 ~ 90
Dielectric Strength KV / mm (25 ℃)
> 20
Dissipation factor (1MHz) (25 ℃)
0.014
Dielectric constant (1MHz) (25 ℃)
3.53
Volume resistivity (DC500V) Ω · cm
1.2 × 1015
Packing: A Component: 4kg / barrel (plastic bucket); B components: 1kg / bucket (plastic barrel).
Storage and transport
1, A, B component to be protected from light, avoid heat, sealed (can be used as non-dangerous goods transport and storage);
2, the storage period of 1 year (25 ℃).
