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Epoxy adhesive is epoxy resin, curing agent, accelerator, modifier, diluent, filler and other components of the liquid or solid adhesive. Adhesive epoxy adhesive is a complex process of physical and chemical processes, including invasion, adhesion, curing and other steps, and finally generate three-dimensional cross-linked structure of the curing, the surface of the material combined into a whole. Bonding properties (strength, heat resistance, corrosion resistance, impermeability, etc.) depends not only on the structure and properties of adhesive and stuck the surface structure and adhesive properties, but also, and joint design, adhesive preparation process and storage and the closely related bonding process, but also by the surrounding environment (stress, temperature, humidity, media, etc.) constraints. Therefore, the application of epoxy adhesive is a systematic project. Performance epoxy adhesive bonding to the performance and the impact of various factors to adapt in order to obtain the best results. Epoxy adhesive with the same formula with different bonding properties of objects, or using different bonding conditions, or to use in different environments, its performance will have a great difference.
Epoxy adhesive features:
Epoxy adhesive compared with other types of adhesive has the following advantages:
(1) contains a variety of polar groups of epoxy resin and epoxy very active, and therefore metal, glass, cement, wood, plastic and other polar materials, especially materials with high surface activity has a strong adhesive force, while the cohesion of the cured epoxy is also a great strength, so its high bonding strength.
(2) curing epoxy resin is essentially free of low molecular weight volatiles generated. Layer of the volume shrinkage is small, about 1% a 2%, is a thermosetting resin curing shrinkage rate of the smallest species. After adding filler can be reduced to 0.2%. Epoxy curing of the linear expansion coefficient is small. Therefore, internal stress, little effect on the bonding strength. Combined with the creep of epoxy curing is small, so the size of layer stability.
(3) epoxy resin, curing agents and modifiers for many varieties, can be formulated through the rational and clever design, the adhesive has the required technology capability (such as fast curing, room temperature curing, low temperature curing, water curing, low viscosity , high viscosity, etc.), and has the required performance (such as high temperature, low temperature, high strength, high flexibility, anti-aging, conductive, magnetic, thermal, etc.).
(4) with a variety of organic compounds (monomers, resins, rubber) and inorganic (such as fillers, etc.) has good compatibility and reactive, easy to carry out copolymerization, crosslinking, blending, filling, such as modified to improve the layer performance.
(5) corrosion resistance and good dielectric properties. To acid, alkali, salt, solvents and other corrosive media. Volume resistivity of 1013-1016Ω · cm, dielectric strength 16-35kV/mm.
(6) general epoxy resin, curing agents and additives, many of origin, production, preparation of simple, accessible molding, to a large-scale applications.
The main drawback of epoxy adhesive:
(1) does not toughness, the general bias of cured brittle, peel, crack resistance, impact of poor performance.
(2) small polar materials (such as polyethylene, polypropylene, fluorine plastic, etc.) adhesive force is small. The surface must be activated.
(3) Some raw materials such as diluents, curing agents have different degrees of toxicity and irritation. Design should try to avoid using the formula, the construction operation should enhance the ventilation and protection.
At present, we mainly supply the epoxy adhesive:
SE202
SE203
SE213
SE216
SE218
3420
SE-100
Two-component, fast curing for five minutes
Strong bonding, can not flow elevation sizing
For metal, ceramic, wood, glass bonding
Packing 50ml / dual
SE-120
Two-component, impact resistance, anti-stripping
Excellent mechanical and electrical properties
For impact resistance and peel strength of the occasion,
Packing 400g / set
SE-140 (one component)
White, single component, heat curing
Excellent electrical properties and thermal stability
For structural bonding
Packing 4kg / barrel
SE-140C (one component)
Black, single component, heat curing
Impact performance
Excellent electrical properties and thermal stability
For structural bonding
Packing 4kg / barrel
Epoxy structural adhesive
Product Code Color curing properties of the cured before the performance of curing conditions
Viscosity, density, temperature constant temperature shear strength of a fixed time
mPa.sg/cm3Mpa ℃ ℃ min
SE-100 translucent 130001.112-40-100255
SE-105 Yellow 75001.122-40-12025/7224h/40min
SE-140 White paste 1.27 ≥ 19-55-15015010
SE-140C Black 700001.2 ≥ 12-55-12012030
