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Conductive silver paste ABLEBOND 84-1A

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Producto / Servicio: Conductive silver paste ABLEBOND 84-1A 
precio unitario: negociable  consulta de precio
la minima cantidad pedida:  
la cantidad total de oferta:
plazo de entrega: entrega dentro de los días a partir de la fecha de pago de comprador
válido hasta el dia: efectividad a largo plazo
actualizaciones últimas: 2011-03-23
veces de vista: 140
informaciones de datos básicos de empresa
 
 
detalles de producto
Model ABLEBOND 84-1A Brand Other
Classification of epoxy resin adhesive degree 18000 (Pa · s)
Adhesive shear strength of material type electronic components 15 (MPa)
Active use of 180 (min) Operating Temperature 25 (℃)
Shelf life of 12 (months)

ABLEBOND 84-1A (conductive silver paste)
For LED Display (light emitting diode)
FILLER TYPE: SILVER silver filler
Viscosity @ 25 ℃ viscosity of 18,000 cps
Work Life @ 25 ℃ effective date for two weeks
Recommended Cure Condition recommend heating for 60 minutes @ 150 ℃ way
Cure Option proposed alternative way of heating for 10 minutes @ 200 ℃
Die Shear Strength (70milC) @ 25 ℃ to push the chip shear strength 6000psi
SiAg Plated / Cu L / F between silicon and silver-plated copper lead frames
Volume Resistively volume of 0.0002 ohm-cm electrical impedance
Ionic Data-ion value
Chloride 50ppm chlorine
Sodium Sodium 5ppm
Potassium K 5ppm
Glass Transition Temperature (Tg) Glass transition temperature of 99 ℃
Coefficient of Thermal
Expansion (TMA) temperature coefficient of expansion Below Tg53ppm ℃
Above Tg23ppm ℃
Thermal Conductivity @ 121 ℃ thermal conductivity LIBU (ft x hr x ℉)
Storage Life @ -40 ℃ storage period of 1 year

ABLEBOND 84-1A (conductive silver paste)
For LED Display (light emitting diode)
FILLER TYPE: SILVER silver filler
Viscosity @ 25 ℃ viscosity of 18,000 cps
Work Life @ 25 ℃ effective date for two weeks
Recommended Cure Condition recommend heating for 60 minutes @ 150 ℃ way
Cure Option proposed alternative way of heating for 10 minutes @ 200 ℃
Die Shear Strength (70milC) @ 25 ℃ to push the chip shear strength 6000psi
SiAg Plated / Cu L / F between silicon and silver-plated copper lead frames
Volume Resistively volume of 0.0002 ohm-cm electrical impedance
Ionic Data-ion value
Chloride 50ppm chlorine
Sodium Sodium 5ppm
Potassium K 5ppm
Glass Transition Temperature (Tg) Glass transition temperature of 99 ℃
Coefficient of Thermal
Expansion (TMA) temperature coefficient of expansion Below Tg53ppm ℃
Above Tg23ppm ℃
Thermal Conductivity @ 121 ℃ thermal conductivity LIBU (ft x hr x ℉)
Storage Life @ -40 ℃ storage period of 1 year
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