Haga clic en la imagen ver dibujo original
ZTD8007-1AL U.S. Iic the latest technology. Is a one-component, low temperature storage, medium viscosity, high-conductive silver adhesive bonding strength. For digital control, dot matrix, LED bonding adhesive such as optoelectronic devices and packages.
Basic parameters
Color Silver
Weight 3.18
Viscosity 11000cps (23 ℃ / 10rpm)
Hardness 80
Decomposition temperature of 380 ℃
Glass transition temperature 110 ℃
Shear strength greater than 3000psi
Coefficient of thermal expansion below the glass transition temperature 40e-6TH; above the glass transition temperature of 100e-6TH.
Operating temperature -55 ℃ to 150 ℃ (continuous); -65 ℃ and 300 ℃ (instantaneous work).
TG 200 ℃ 0.22%; 300 ℃ 0.65%; 400 ℃ 2.60%.
Volume resistivity 0.00023 ohm - cm
Thermal conductivity 2.3W/m0K
Curing condition 150 ℃ 60-90 minutes
Storage period of 0 ℃ 3 months; -15 ℃ 6 months.
Note that can be properly stirred at room temperature to use.
