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New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic

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Producto / Servicio: New nano package of silica gel, epoxy, conductive silver paste and the PCB thermal plastic 
modelo: 00 
especificación: JTW-D型风机盘管接头 
precio unitario: 2000dólares/A  consulta de precio
la minima cantidad pedida:   pedido
la cantidad total de oferta: 10000 A
plazo de entrega: entrega dentro de los días a partir de la fecha de pago de comprador
válido hasta el dia: efectividad a largo plazo
actualizaciones últimas: 2011-03-23
veces de vista: 137
informaciones de datos básicos de empresa
 
 
detalles de producto
1 package silicone: SEL-SI 1/SEL-SI 2
2. Features (SEL-SI series)
- Excellent light transmission rate, through a variety of wavelengths of LED light
- Provide excellent cushioning and moisture protection
- Packaged with the excellent performance of anti-UV
- Excellent stability
General Characteristics:

Before curing
Composition of mixture (weight) Viscosity
(25 ℃ / CPS) curing conditions
(℃ / Hr)
SEL-SI1-A, B two-component 1:14000130 / 0.5 ~ 1
SEL-SI2-A, B two-component 1:14500140 / 1
After curing
Hardness
(Shore A) refractive index of light transmission rate
(%, 450nm, 1mm)
SEL-SI1-A, B601.5399.9
SEL-SI2-A, B651.5399.9


2, conductive silver paste: SPT500/900/1000/3000/5000
Specifications: 1.2W/1.3W/1.8W/3W/5W etc.
Features (SPT Series)
- High flexibility
- No yellowing
- Excellent heat resistance and stability

Comparative test data
List of units Able bond 3230SPT-500SPT-900
Viscosity
(HBDV-Ⅲ, # 51) 0.5 rpm
cps532005430052200
5 rpm950096939100
Thixotropic index -5.65.15.7
Solid content%-99.7Min. 97
Weight Kg /? -2.892.86
Curing conditions ° c/hr170 ° c/1hr150 ° c/0.5hr150 ° c/0.5hr
Na +

PPM <10 <100
K + <5 <50
Cl-<10 <100

Expansion coefficient α1
? / M ℃ 807779
α2205216175

Tensile modulus of 25 ℃
Mpa296529651523
250 ℃ 9090122
DSC (heat test) Onset (initial)
℃ - 105
Peak (peak) - 113
Tg (TMA) point ℃ 375582
Thermal conductivity (@ 121 ℃) W/mk0.61.21.83
Volume resistivity Ohm-cm0.050.00420.000117


3, epoxy resin SEL-1409/SEL-1409SE/SEL-1410/SEL-1500 etc.

Features:
1) low curing temperature (120 ℃ -130 ℃)
2) Excellent physical, mechanical, water and heat resistance
3) According to requirements, the product fully applicable to the LED molding process
Typical performance:

Item SEL-EX-1409ASEL-EX-1409B

Appearance transparent liquid transparent liquid
Main material of epoxy resin anhydride
Viscosity (25 ℃) 4000 ± 1000cps100 ± 20 cps
Specific gravity 1.17 ± 0.021.17 ± 0.02

After hardening characteristics:

Item number value of the standard
Hardness 90Shore D
Pulled up the strength (kg /?) 1000JIS K-6911
Soft and degree (kg /?) 1200JIS K-6911
Expansion coefficient (mm / mm / ℃) 8.0 × 10-5JIS K-6911
Impact resistance coefficient (kg cm /?) 2.2JIS K-6911
Tg point (℃) 135DSC
Water Absorption (boiling water) 0.15JIS K-6911

Electrical properties after hardening:

Item number value of the standard
Breakdown coefficients (kV / mm) 25Min.JIS K-6911
Impedance (? Cm) 1016 Min.JIS K-6911
Dielectric constant (25 ℃, 1kHz) 3.0JIS K-6911
Dielectric tangent (25 ℃, 1kHz) 0.013JIS K-6911


Optical properties after hardening:

Item number value of the standard
Transmittance (%) 92% Min.500 ~ 700Nm, t = 1 mm
Refractive index of 1.54
Instructions:

1) mixing ratio
Epoxy resin: curing agent = 1: 1 (weight)
2) The viscosity of the mixture
700 ± 200 cps (25 ℃)
3) Operating time *
25 ℃ 5 小时
40 ℃ 4 小时
* Operating points for the year to 3,000 cps
4) curing conditions
Condition 1 - Preheat 125 ℃, 1Hr + after baking 125 ℃, 3Hr
Condition 2 - Preheat 140 ℃, 30min. + After baking 125 ℃, 3Hr
5) The time after mixing deaeration
Room temperature (25 ℃).
* Heating deaeration will reduce the operating time
Dry and refrigerated storage of 10-25 ℃ storage, heating products, or place not too low temperatures. The word is valid from the date of production of products for 6 months
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