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DT1204 low temperature silver conductive adhesive
Product Description:
DT1204 series of conductive adhesives are epoxy, epoxy glue is a high viscosity and high conductivity of silver nanoparticles in organic synthesis, is a one-component conductive adhesive. Products meet the European Union EN / ASTM and GB standards, a variety of hard metal surface between the metal and nonmetal surface ideal for bonding between the products, can replace solder bonding to complete various types of electronic components, conductive ceramics can also be completed Bonding and microwave components. Widely used in aerospace, microwave, radar, computers, automotive electronics, consumer electronics and other fields
Typical use:
Crystal oscillators, LED light-emitting diode, IC chip, connections, connections chip components, SMT circuit repair
Features:
1) The silver content: 78% ± 2
2) Viscosity: 12 ~ 20 Pa.s
3) Thixotropic Index: 6.0 ~ 7.5
4) Fineness: ≤ 10um
5) curing the object resistance: ≤ 1.0 × 10-3Ω · cm
6) The shear strength: ≥ 20N
7) Thermal conductivity: 2.0W/mk
8) Flexible rate: 250 ~ 350Mpa
9) Curing condition: 130 ℃ / 60min, 150 ℃ / 30min, 170 ℃ / 10min
10) Storage: ≤ 0 ℃ 6 months
