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K129-L silver conductive adhesive
Product Description
TK129-L technology for the U.S. TiC latest products. Is a one-component, low temperature storage, medium viscosity, high-conductive silver adhesive bonding strength. For light-emitting diode (LED) optical devices and electronic devices such as bonding and packaging.
Basic parameters
Color Silver
Weight 3.18
Viscosity 4600 cps (23 ℃ / 10 rpm)
Hardness 80
Decomposition temperature of 380 ℃
Glass transition temperature 110 ℃
Shear strength greater than 3000 psi
Impact strength is greater than 10Kg/5000 psi
Coefficient of thermal expansion below the glass transition temperature 40e-6TH; above the glass transition temperature of 100e-6TH.
Operating temperature -55 ℃ to 150 ℃ (continuous); -65 ℃ and 300 ℃ (instantaneous work).
TG 200 ℃ 0.22%; 300 ℃ 0.65%; 400 ℃ 2.60%.
Volume resistivity 0.00023 ohm - cm
Thermal conductivity of 2.3 W/m0 K
Curing condition 150 ℃ 60-90 minutes
Storage period of 0 ℃ 3 months; -15 ℃ 6 months.
Note that can be properly stirred at room temperature to use.
